信天堂

工艺制程能力

制程
Process
项目
Item
通常
Normal Capability
改进
Advanced capability
内层         Inner layer
内层线路
 Inner layer exposure
最小板厚(不含铜)
Min. board thickness (without Cu)
0.075mm 0.05mm
对位公差
Registration tolerance
+/-2mil +/-1.5mil
内层铜厚
Inner copper thickness
2OZ 3OZ
线宽/线距
wire width/space
4/4mil 3/3mil
内层孔到线间距
 Inner layer hole to wire
4
4L
7mil 6mil
6
6L
8mil 7mil
8
8L
9mil 8mil
10层及以上
10L& above
10mil 9mil
压合
Lamination
最大层数
Max layer count
10L 12L
层间对准度
Layer to lay registration
+/-4mil +/-3mil
铜箔厚度
Copper foil thickness
0.5OZ~3OZ 1/3OZ-3oz
介电层厚度公差
Dielectric layer thickness tolerance
±10% ±8%
钻孔
Drilling
最大钻孔孔径
Max. drilling size
6.0mm 6.5mm
最小钻孔孔径
Min drilling size
0.25mm 0.2mm
孔位精度公差
Drilling hole tolerance
+/-3mil +/-2mil
NPTH 孔径公差
NPTH hole size tolerance
+0/-0.05mm +0/-0.025mm
PTH 孔径公差(完成)
PTH hole size tolerance (finished)
+/-3mil +/-2mil
孔壁粗糙度
Hole roughness
25µm 20µm
沉铜电镀
PTH
生产孔径(最小)
Hole size (Min)
0.25mm 0.2mm
纵横比(最大)
Aspect ratio(Max)
8:1 101
线路
Image transfer
外层最大铜厚
Max. Cu thickness
3OZ 4OZ
干膜最大封孔能力
Dry film tenting
4.5mm 6.0mm
对位公差
registration tolerance
+/-2mil +/-1.5mil
线宽/线距 (底铜0.5OZ)
Wire Width/Space (base Cu 0.5OZ)
4/4mil (底铜0.5OZ) 3/3mil
阻焊
Solder mask
绿油桥最小宽度
Min. Solder bar 
4mil 3mil
绿油厚度
Soler mask thickness
线角≧7µm(line corner)
线面≧10µm (line surface)
线角≧7µm(line corner)
线面≧10µm (line surface)
对位公差
Registration tolerance
+/-2mil +/-1.5mil
塞孔最大孔径
 Hole plugging size
0.45mm 0.55mm
SMT PAD之间最小距离
 Min. PAD space
7mil 6mil
字符
Legend
最小线宽线距
Min. line width/space
4mil/4mil 3.5mil/3.5mil
白字最小内径
Inner diameter of digital
8mil 7mil
碳油
Carbon ink
碳油方阻
 Rectangular resistance
40ohm 30ohm
印油PAD最小间距
Min carbon ink space
30mil 25mil
成型
Routing
锣板尺寸公差
Routing tolerance
+/-4mil +/-3mil
最小锣刀
Min routing bit
0.8mm 0.7mm
槽位到锣边距离
routing slot to side
10mil(0.25mm) 8mil(0.2mm)
啤板
Punching
啤板尺寸公差
Punching tolerance
+/-4mil +/-3mil
孔到边精度
hole to side
±5mil (0.125mm) ±4mil (0.1mm)
V-CUT
上、下V坑线对准度
Leveling of top/bottom V-cut line
±4mil (0.1mm) ± 3mil (0.075mm)
余厚控制精度
 web thickness
±4mil (0.1mm) ± 3mil (0.075mm)
V坑位置公差
V-Cut position
±4mil (0.1mm) ± 3mil (0.075mm)
电测试
E-testing
测试最小PAD
Min testing PAD
10mil 8mil
表面处理
Surface finish
OSP厚度
OSP film thickness
0.2-0.5µm 0.25-0.5µm
沉锡厚度
Immersion Tin thickness
0.8-1.2µm 1.0-1.2µm
沉银厚度
Immersion Ag thickness
0.1-0.3µm 0.2-0.3µm
化金厚度
Immersion Au thickness
1-2.5µ 1-2.5µ
沉镍厚度
Immersion Nick thickness
120-250µ 160-250µ
有铅喷锡厚度
HASL (Pb)
1-40µm 2-40µm
无铅喷锡厚度
HASL (Pb free)
1-40µm 2-40µm
其它能力
Other
阻抗控制
Impedance tolerance
±10% ±8%
板弯板曲
Board warpage/twist
0.75% 0.50%
内外层线宽公差 ±20% ±15%
外层最大板尺寸
Max Board size
610x450mm 630x510mm
外层最小板尺寸
Min. board size
75*75mm 50*50mm
外层最大板厚
Max board thickness
2.5mm 3.2mm
外层最小板厚
Min board thickness
0.4mm 0.3mm

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